HAIBIN ZHAO

Karlsruher Institute of Technology (KIT)
Institut of Telematics (TM) – Chair for Pervasive Computing Systems (PCS)
TecO Reasarch Group

Vincenz-Prießnitz-Str. 1,
Building 07.07, 2.OG,
Room 214,
76131, Karlsruhe, Germany

Email: haibin.zhao@kit.edu

SHORT CV

  • Since 01.2021 Research Associate / Ph.D. candidate in Informatics at TecO, KIT, Germany.
  • 11.2018 – 11.2020 M.Sc. in Mechatronics and Information Technology from KIT, Germany
  • 09.2013 – 07.2017 B.Sc. in Mechanical Engineering from Chongqing University, China.

PROJECTS

  • JuBotJung bleiben mit Robotern (engl. Staying Young with Robots)
  • MERAGEM: Modellierung, Entwurf, Realisierung und Automatisierung von Gedruckter Elektronik und ihren Materialien (engl. Modelling, design, realisation, and automation of printed electronics and their materials)
  • Data Scientist @ SDIL — Smart Data Innovation Lab
  • EUHub4DataFreshIndex: Safety and Holistic Sustainability in the Food Sector with AI and IoT
  • SoftNeuRo: Soft-Electronics and Neuromorphic Systems for Resource-Constraint Artificial Intelligence in Soft Robotics and Wearables
  • Fit2Ear: Personalized Otoplastic from Smartphone Depth Camera

RESEARCH

Available Thesis

  • Routing, placement, and architecture co-design for printed neuromorphic circuits
  • (other intuitive topics are also welcome)

Finished/Running Thesis

PUBLICATION

2024
Deep Neural Network Pruning with Progressive Regularizer
Zhou, Y.; Zhao, H.; Hefenbrock, M.; Li, S.; Beigl, M.
2024. 2024 IEEE International Joint Conference on Neural Network (IJCNN 2024), Yokohama, 30th June - 05 July 2024, Institute of Electrical and Electronics Engineers (IEEE) VolltextVolltext der Publikation als PDF-Dokument
A Survey on Wearable Human Activity Recognition: Innovative Pipeline Development for Enhanced Research and Practice
Huang, Y.; Zhou, Y.; Zhao, H.; Riedel, T.; Beigl, M.
2024. 2024 IEEE International Joint Conference on Neural Networks (IJCNN 2024), Yokohama, 30th June - 5th July 2024, Institute of Electrical and Electronics Engineers (IEEE) VolltextVolltext der Publikation als PDF-Dokument
Fault Sensitivity Analysis of Printed Bespoke Multilayer Perceptron Classifiers
Pal, P.; Afentaki, F.; Zhao, H.; Saglam, G.; Hefenbrock, M.; Zervakis, G.; Beigl, M.; Tahoori, M. B.
2024. 29th IEEE European Test Symposium (ETS 2024), Institute of Electrical and Electronics Engineers (IEEE) VolltextVolltext der Publikation als PDF-Dokument
Analog Printed Spiking Neuromorphic Circuit
Pal, P.; Zhao, H.; Shatta, M.; Hefenbrock, M.; Mamaghani, S. B.; Nassif, S.; Beigl, M.; B. Tahoori, M.
2024. 2024 Design, Automation and Test in Europe Conference (DATE), 6 S., Institute of Electrical and Electronics Engineers (IEEE) VolltextVolltext der Publikation als PDF-Dokument
Enhancing Efficiency in HAR Models: NAS Meets Pruning
Zhou, Y.; King, T.; Huang, Y.; Zhao, H.; Riedel, T.; Röddiger, T.; Beigl, M.
2024. 22nd IEEE International Conference on Pervasive Computing and Communications (PerCom 2024), Institute of Electrical and Electronics Engineers (IEEE) VolltextVolltext der Publikation als PDF-Dokument
Optimizing AutoML for Tiny Edge Systems: A Baldwin-effect Inspired Genetic Algorithm
Huang, Y.; Zhou, Y.; Zhao, H.; Riedel, T.; Beigl, M.
2024. 22nd IEEE International Conference on Pervasive Computing and Communicaitons (PerCom 2024), Institute of Electrical and Electronics Engineers (IEEE) VolltextVolltext der Publikation als PDF-Dokument
2023
Towards Temporal Information Processing – Printed Neuromorphic Circuits with Learnable Filters
Zhao, H.; Pal, P.; Hefenbrock, M.; Beigl, M.; Tahoori, M. B.
2023. 18th ACM International Symposium on Nanoscale Architectures (NANOARCH 2023), Dresden, 18.12 - 20.12.2023), Association for Computing Machinery (ACM). doi:10.5445/IR/1000164433VolltextVolltext der Publikation als PDF-Dokument
Standardizing Your Training Process for Human Activity Recognition Models – A Comprehensive Review in the Tunable Factors
Huang, Y.; Zhao, H.; Zhou, Y.; Riedel, T.; Beigl, M.
2023. Proceedings of the 20th EAI International Conference on Mobile and Ubiquitous Systems: Computing, Networking and Services (MobiQuitous 2023), Springer VolltextVolltext der Publikation als PDF-Dokument
Power-Aware Training for Energy-Efficient Printed Neuromorphic Circuits
Zhao, H.; Pal, P.; Hefenbrock, M.; Beigl, M.; Tahoori, M.
2023. 42nd IEEE/ACM International Conference on Computer-Aided Design, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/ICCAD57390.2023.10323917VolltextVolltext der Publikation als PDF-Dokument
Excerpt from “Sensing with Earables: A Systematic Literature Review and Taxonomy of Phenomena”
Röddiger, T.; Clarke, C.; Breitling, P.; Schneegans, T.; Zhao, H.; Gellersen, H.; Beigl, M.
2023. Adjunct Proceedings of the 2022 ACM International Joint Conference on Pervasive and Ubiquitous Computing and the 2022 ACM International Symposium on Wearable Computers, 244–245, Association for Computing Machinery (ACM). doi:10.1145/3544793.3563413
Highly-Bespoke Robust Printed Neuromorphic Circuits
Zhao, H.; Sapui, B.; Hefenbrock, M.; Yang, Z.; Beigl, M.; Tahoori, M. B.
2023. 2023 Design, Automation and Test in Europe Conference & Exhibition (DATE), Institute of Electrical and Electronics Engineers (IEEE) VolltextVolltext der Publikation als PDF-Dokument
Split Additive Manufacturing for Printed Neuromorphic Circuits
Zhao, H.; Hefenbrock, M.; Beigl, M.; Tahoori, M. B.
2023. 2023 Design, Automation & Test in Europe Conference & Exhibition (DATE) VolltextVolltext der Publikation als PDF-Dokument
2022
Aging-Aware Training for Printed Neuromorphic Circuits
Zhao, H.; Hefenbrock, M.; Beigl, M.; Tahoori, M. B.
2022. International Conference on Computer Aided Design (ICCAD ’22), October 30-November 3, 2022, San Diego, CA, USA, Art.-No.: 38, Association for Computing Machinery (ACM). doi:10.1145/3508352.3549411VolltextVolltext der Publikation als PDF-Dokument
Printed Electrodermal Activity Sensor with Optimized Filter for Stress Detection
Zhao, H.; Scholz, A.; Beigl, M.; Ni, S.; Singaraju, S. A.; Aghassi-Hagmann, J.
2022. International Symposium on Wearable Computers (ISWC’22) , Atlanta, GA and Cambridge, UK, September 11-15, 2022, 112–114, Association for Computing Machinery (ACM). doi:10.1145/3544794.3558479VolltextVolltext der Publikation als PDF-Dokument
TinyHAR: A Lightweight Deep Learning Model Designed for Human Activity Recognition
Zhou, Y.; Zhao, H.; Huang, Y.; Hefenbrock, M.; Riedel, T.; Beigl, M.
2022. International Symposium on Wearable Computers (ISWC’22) , Atlanta, GA and Cambridge, UK, September 11-15, 2022, 89–93, Association for Computing Machinery (ACM). doi:10.1145/3544794.3558467VolltextVolltext der Publikation als PDF-Dokument
Sensing with Earables: A Systematic Literature Review and Taxonomy of Phenomena
Röddiger, T.; Clarke, C.; Breitling, P.; Schneegans, T.; Zhao, H.; Gellersen, H.; Beigl, M.
2022. Proceedings of the ACM on Interactive, Mobile, Wearable and Ubiquitous Technologies, 6 (3), Article 135. doi:10.1145/3550314VolltextVolltext der Publikation als PDF-Dokument
Improving Human Activity Recognition Models by Learnable Sparse Wavelet Layer
Zhao, H.; Zhou, Y.; Riedel, T.; Hefenbrock, M.; Beigl, M.
2022. International Symposium on Wearable Computers (ISWC’22) , Atlanta, GA and Cambridge, UK, September 11-15, 2022, 84–88, Association for Computing Machinery (ACM). doi:10.1145/3544794.3558461VolltextVolltext der Publikation als PDF-Dokument
2021
AirCase: Earable Charging Case with Air Quality Monitoring and Soundscape Sonification
Zhao, H.; Roddiger, T.; Beigl, M.
2021. Proceedings of the 2021 ACM International Joint Conference on Pervasive and Ubiquitous Computing and Proceedings of the 2021 ACM International Symposium on Wearable Computers: September 21-25, 2021 ; Virtual Event, 180–184, Association for Computing Machinery (ACM). doi:10.1145/3460418.3479329
Kalman Filtered Compressive Sensing Using Pseudo-Measurements
Zhao, H.; Funk, C.; Noack, B.; Hanebeck, U. D.; Beigl, M.
2021. Proceedings of the 2021 IEEE International Conference on Multisensor Fusion and Integration for Intelligent Systems (MFI 2021), 1–8, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/MFI52462.2021.9591186